Bluetooth News Reference
SMYRNA, Ga.--(BUSINESS WIRE)--May 22, 2001--Murata Electronics
North America (www.murata.com),
a world-leading innovator in electronics, today introduced Blue
Module(TM), the world's smallest Bluetooth(TM) module.
Developed using unique Low Temperature Co-Fired Ceramics (LTCC)
technology, Murata integrates both active devices (IC's) and passive
components onto a single surface mount ceramic chip that supports
Universal Serial Bus (USB), Universal Asynchronous Receiver Transmitter
(UART), and Pulse Code Modulation (PCM) interfaces.
The newest and most advanced wireless technology, Bluetooth allows
electronic devices to communicate without wires or cables. Cellular
phones, Personal Digital Assistants (PDAs), notebook and desktop
PC's, wireless printers, mouses and keyboards all benefit from
Murata's revolutionary Bluetooth module.
``Murata is at the forefront of design engineering of components
for Bluetooth enabled devices. Not only have we created the world's
smallest and most complete module for wireless technology, but
we have simplified the design and layout for the customer,'' said
Scott Klettke, Market Segment Manager for Murata Electronics North
America. ``Design engineers no longer have to source and mount
several components to achieve the desired solution. With Murata's
complete package, they have the freedom to focus on their core
competencies.''
To achieve the smallest Bluetooth module, the passive components
and matching circuits are integrated within the substrate of the
chip, making it both a carrier of the IC and a functional device.
Traditionally, most design engineers place the IC on a Printed
Circuit Board (PCB) and mount the supporting passives, memory
and matching elements.
With Murata's product, all the components are already integrated
into a single surface-mount ceramic chip. Aside from the benefit
of a smaller size, reduced burden to the design engineer, and
reduced inspection time, sourcing and inventory costs can be reduced
because the all-in-one device eliminates the line item cost of
managing several part numbers on a bill of materials.
In total, approximately 60 components are embedded in the 14.5
x 11.9 x 2.3mm module - including a RF/Baseband IC that is mounted
in a cavity on the bottom surface of the substrate. Murata mounts
a Power Amplifier (PA) to increase the output power and a Low
Noise Amplifier (LNA) to improve sensitivity on the surface of
the substrate as well.
Additionally, there are several parts and functions that are
integrated within the substrate such as a Band Pass Filter, a
Balun and other passives. Lastly, a switching diode, flash memory
and crystal oscillator pieces are arranged on the substrate. Murata's
Blue Module(TM) has achieved Logo Certification of Version 1.0b
+ CE and will acquire version 1.1 shortly.
Murata's Bluetooth module is available for sampling at $100 each.
Sample kits that include working models (2 units), evaluation
boards, and development kit software are available upon request
for $300.
The BLUETOOTH trademarks are owned by Bluetooth SIG, Inc., U.S.A.
About Murata Electronics North America
Murata Electronics North America, Inc. (www.murata.com) is one
of 47 wholly-owned subsidiaries of the worldwide organization
of Murata Manufacturing Co., Ltd. of Japan (NIKKEI:6981). Established
in 1965, U.S operations are headquartered in Smyrna, Georgia,
with a manufacturing facility in State College, Pennsylvania.
Murata is a leading patent holder and global manufacturer of
ceramic electronic components for the telecommunications, computer/peripheral,
automotive, communications and EDP markets.
Contact:
Merritt Group, Inc.
Amy Talley, 703/556-6300 x145
talley@merrittgrp.com
or
Murata Electronics North America, Smyrna
Chinita Seiz, 770/433-5782
cseiz@murata.com
